Lab on a chip
High Transparent
Lower PDMS porous size
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Epoxy Curing Agent
Solvent Base and Solvent Free Base
Electronic Industry, Aerospace Industry
PDMS,Epoxy,Acrylic Resin
Remover/Stripper
Sandwich Structure Fabrication
Carbon Fiber, Glass Fiber,
Kevlar Fiber
Honeycomb Core
Electronic Industry, Component Assembly
Room Temp. Cure Adhesive
UV Cure Adhesive
Structure Acrylic Adhesive
